IMS pool now with enhanced base material

We have upgraded the Insulated Metal Substrate type we use in our IMS pool service

More powerful LED applications demand an increased focus on thermal management. More powerful LEDs produce more heat and temperature rise has an impact on the short-term function of a LED part such as colour shift and reduced light output.

The long-term effects shouldn’t be neglected either. Higher operating temperatures result in a reduced life time.

To reduce the operating temperature and thus the impact of the temperature on LED applications or power converters, we decided to make an upgrade on the IMS material. The former used Polytherm TC-Lam 1.3 is now succeeded by Polytherm TC-Lam 2.0 of which you can find the spec sheet on our Download page.

The main difference is the dielectric. This thermally conductive layer has better properties:

• Thermal conductivity: 2.0 W/mK (upgrade from 1.3 to 2.0)
• Thermal resistance: 0.50 K/W (lowering from 0.77 to 0.5)

The thick Aluminium (alloy 5052) layer remains unchanged and is responsible for the heat dissipation.

The Cu foil, on the opposite side, is still 35 microns thick. This Cu layer forms the base Cu for the circuit. Other service parameters remain unchanged and can be found here.

“How do we make IMS boards?”, explained on Eurocircuits TV.

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Eurocircuits TV has made an informative piece on how copper is deposited on the PCB in the galvanic process.

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